From Two Bit da Vinci.
Moore’s Law isn’t dead — but it’s running out of room. For decades, we made chips faster by making transistors smaller. Now we’re hitting the physical limit of how small you can go. So Huawei asked a different question: what if instead of shrinking, you fold?
At ISSCC 2026, Huawei unveiled τ-Scaling — a formal framework for continuing to scale performance when geometry alone won’t cut it anymore. The idea: every level of the computing stack has slack you haven’t used yet. Wire too long? Fold the circuit. Chip-to-chip communication too slow? Bond them face-to-face. Thousands of chips acting like strangers? Make them behave like one brain.
They call it the Four Foldings — and it might be the most complete answer anyone has given to the post-Moore question.
Want to know more? https://www.huawei.com/en/news/2026/5/ieee-iscas-tau-scaling
#Huawei #IEEE #Engineering #Semiconductors #MooresLaw #Technology #ChipDesign #FutureTech
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00:00 Huawei just rewrote the rules
00:37 Why Moore’s Law is hitting a wall
02:28 The wire delay nobody talks about
03:05 Logic folding: how it actually works
03:48 How they build it: copper bonding at atomic scale
04:21 The geometric leap: 12,000 → 1,000,000 connections
05:35 Scaling it to AI data centers
06:18 Folding vs. stacking — they’re not the same thing
07:19 The Four Foldings framework
07:48 Heat, TSVs, and the hard engineering problems
09:25 Can you keep folding? More layers, new era
10:30 Innovation from constraint
12:08 Why energy efficiency is the real prize
